Mobile products increasingly require EMI (Electromagnetic Interference) shielding. In the past EMI shielding has been done with metal lids (“metal cans”) on packages or sprayed on epoxy shielding materials.
In order to improve the shielding performance, increase product yield and reduce the thickness of shielded packages the use of conformal shielding with metal sputtering has been introduced.
Tango Systems is the leading supplier for next generation shielding technologies. Both for single layer as well as multi-layer shielding. With the introduction of high capacity carriers based on multi-process chamber cluster technology Tango has been able to offer the lowest CoO (Cost of Ownership) for any sputtered EMI shielding process.
Key challenges to overcome with metal sputtering for EMI shielding:
• Metal sputtering on organics (contaminants, moisture) requires efficient surface treatment prior to sputtering
• Temperature control while maintaining high throughput
Tango’s proprietary segment carrier design maximizes the number of packages that can be placed on a single carrier. This enables the highest volume packages to cycle through the sputter equipment. At the same time the available active backside cooling allows for processing temperatures to be kept below 100 degrees C. A closed loop temperature monitoring system allows for continuous sputtering without exceeding the recipe set temperature points.
The cluster design of the Axcela HVM tool makes it possible for users to start with a single process chamber for low volume runs. Adding process chambers to already installed Axcela systems can be done in less than one hour. No other EMI shielding equipment has the capability to offer modular expansion to quickly adapt to manufacturing volume changes.