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Embedded Die

Embedded Die packaging offers miniaturization and cost benefits as the Fan Out technology. A variety of thinned devices can be embedded along with integrated passives into the package. Some infrastructure is evolving for this technology from PCB laminate.

The Topaz platform provides the deposits the adhesion and seed layers on large panels ranging from 410x515mm to 530x530mm.

Click here for more information on Topaz.

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