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Tango has positioned itself for fast growing and technically challenging application in the PVD metal sputtering application segment. With the focus on Advanced Packaging and Next Generation substrate technologies, Tango Systems has been able to leapfrog competitors with technically superior and more cost effective process approaches.

EMI Shielding
A backside metal (BSM) is commonly used in standard bipolar and high performance power and discrete devices.

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Through Silicon Via
Through Silicon Via (TSV) has emerged as the process of choice of interconnecting stacked and thinned 2-D circuits.

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UBM/RDL Bumping
UBM stack must provide a strong, stable low resistance electrical connection to the IC’s pads and the surrounding passivation layer.

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RDL for Fan Out
TSV technologies are being developed for the next generation of packaging and Tango Systems is ready to take on the challenge.

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Backside Metallization
Nano-films are finding increasing applications in emerging technologies as film-stack engineering becomes more advanced and feature sizes are minimized.

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BEOL Metal & Dielectric films
Conventionally, the MEMS is used to fabricate physical sensors such as pressure sensor, accelerometer, gyroscope.

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MEMS/LEDs
A backside metal (BSM) is commonly used in standard bipolar and high performance power and discrete devices.

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Embedded Die
Through Silicon Via (TSV) has emerged as the process of choice of interconnecting stacked and thinned 2-D circuits.

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Wearable Electronics
UBM stack must provide a strong, stable low resistance electrical connection to the IC’s pads and the surrounding passivation layer.

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