Company - Background
Tango Systems, Inc. was founded by senior business and technical executives in the thin film engineering and PVD fields. Recognizing the processing need and exceptional growth potential in advanced packaging and MEMS, Tango Systems, Inc. develops, manufactures, markets and services advanced PVD sputtering systems used for high volume manufacturing of flip chip and wafer level chip scale packaging with the lowest cost of ownership.

Tango System, Inc.'s Axcela™200/300 platforms are the first in a new line of Small-Batch-Cluster tools, designed to meet the processing needs of the advanced packaging and MEMS industry. The unique Small-Batch-Cluster architecture, coupled with the patent protected D-Source magnetron technology and unique ICP clean configuration, make the Axcella™200/300 series tools the most flexible, reliable, and cost effective systems in their class. The scalability and processing capabilities of the platform are driving Tango Systems, Inc. rapidly into a wider array of product markets.

Tango Systems, Inc.'s 15,000 square foot facility in the heart of Silicon Valley contains a state-of-the-art class 100 clean-room for process development and rapid prototyping of new products. Coupled with the process development expertise of Hionix, Inc., our experienced technical team provides customers with unparallel opportunities in advancing their thin film processing capabilities.