Products - Source Technology - PVD
Advanced D-Source Magnetron Technology
The Bumper™200/300’s innovative, patent protected D-Source magnetron technology is the process driver for the system. Processing advantages include:
- Wide process window (1-20 mtorr)
- High plasma density
- Higher deposition rates
- Rapid (10 minute) target change
- Full face target erosion resulting in
- >50% target utilization
- minimum reclaim cycles
- minimum target material costs
- minimum particulates (<30@1um TiW processing)
- Smallest Target Geometry, Maximum Collection Efficiency
- Uniform films, better than 3% within wafer and wafer to wafer
| |
SEM Image
|
|
