Applications - Overview
The growth in the consumer micro-electronics, wireless communication, LCD display is placing an increasing emphasis on the efficient, reliable processing of Wafer Level packaging and LCD drivers. Additional IC backend scaling is pushing IC package designers towards more complex Multi-Chip Modules, SiPs, Stacked MCP, 3-D IC with TSVs, and WLCSP designs where potential cost and size advantages are well understood but difficult to achieve in a high volume manufacturing environment. Recent progress in MEMS such as medical devices, smart sensors, and green energy provides emerging applications in metallization. As a result, more flexible and efficient manufacturing tooling is required to enabling the successful deployment of these applications.