Applications - Through Silicon Via (TSV)
As the semiconductor industry continues its quest for 32 nm and below features to achieve faster speed through relentless 2-D device scaling, the challenges seem insurmountable. Through Silicon Via (TSV) has emerged as the process of choice of interconnecting stacked and thinned 2-D circuits. Applications for TSV include image sensors, flash, DRAM, processors, FPGA, and power amplifiers.
The Tango Systems, Inc. solution with Axcela™ System integrates the ICP Etch in the deposition chamber
- In-situ ICP Clean
- High step coverage
- Fewer chambers
- Lower costs
- Smaller foot print
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TSV
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